CW provides SMT, DIP ,assembly, testing, and packaging the whole process technology services .
| Process Capability | ||||
|---|---|---|---|---|
| Item | Process | M/C vender/model | Capability | Index |
| 1 | Screen Printer | Panasonic / SPG | Cpk 2.0 @ +/-5 um | Cycle time: 10 sec + print |
| 2 | Screen Printer | EKRA / SERIO4000 | Cpk2.0 @+/-12 um | Cycle time: 11 sec + print |
| 3 | SPI | Parmi/SH-60 | Height accuracy 3 um & GR&R <10 % | Min. pads size 200um □ |
| 4 | Pick & Place Mounter | Samsung / SM481 | X/Y accuracy Cpk 1.33 @ +/- 50 um | 01005 ready |
| 5 | Pick & Place Mounter | Panasonic/CM602 | X/Y accuracy Cpk 1.33 @ +/- 40 um | POP & 01005 ready |
| 6 | Pick & Place Mounter | Panasonic/NPM W2 | X/Y accuracy Cpk 1.66 @ +/- 40 um | 03015/POP & BGA/CSP/Flip Chip ready |
| 7 | AOI | TRI/TR7700SII | Resolu. 10um & 14s @ M-size PCB | 01005 ready |
| 8 | Reflow | Heller / MK3ECO 13 Zone | △T < 4 ℃ & max. Temp. 350℃ | N2 ready & T /B 13/13 Zone 3 cooling |
| 9 | PCBA Router | EM 5700N | Cpk > 1.33 @ +/- 50 um | |
| 10 | Laser Cutting | ChenWei / CW1358 | Cpk > 1.33 @ +/- 10 um | Green Led Laser/14W /λ532nm |
| 11 | Laser marking | ChenWei / CW1860 | Marking area 100x70mm | YAG Laer/10W/λ 9~11um |
| 12 | X-Ray Inspection | X-EYE3100H | Missing Parts /Solder Bridge / Voids / Open | 2.5D for cold/ false soldering/solder bridge/solder short /solder insufficient |
| 13 | Baking | Csun / QMO 2 | Accuracy +/- 3℃ | Max. 250 ℃ |
CW provides SMT, DIP , assembly, testing, and packaging – the whole process technology services . more
